Title:
ELECTRONIC COMPONENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/045856
Kind Code:
A1
Abstract:
A method for manufacturing an electronic component in which circuit elements are fabricated on a ceramic substrate (1). The method is suitable for massproduction of an electronic component with high accuracy even if the electronic component is of a small size. The method comprises eleventh to thirteenth steps executed in this order. In the eleventh step, circuit elements (3) are fabricated on a large ceramic substrate (1) having dividing grooves (4) formed at least in one direction in the surface of the ceramic substrate (1). In the twelfth step, the ceramic substrate (1) is diced in a direction generally perpendicular to the dividing grooves (4) so as to produce rectangular strips (12) where unit electronic component pieces (10) are strung. In the thirteenth step, the substrate (1) is divided into the unit electronic component pieces (10) by imparting stress to the substrate (1) so as to cut the rectangular strips (12) along the dividing grooves (4).
Inventors:
SUZUKI RYUUSUKE (JP)
Application Number:
PCT/JP2004/015708
Publication Date:
May 19, 2005
Filing Date:
October 22, 2004
Export Citation:
Assignee:
MINOWA KOA INC (JP)
SUZUKI RYUUSUKE (JP)
SUZUKI RYUUSUKE (JP)
International Classes:
H01C17/00; H01C17/28; (IPC1-7): H01C17/06
Foreign References:
| JP2003142304A | 2003-05-16 | |||
| JP2002353012A | 2002-12-06 | |||
| JPH0529102A | 1993-02-05 | |||
| JPH0722213A | 1995-01-24 | |||
| JP2003309004A | 2003-10-31 | |||
| JPH10177904A | 1998-06-30 |
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