Title:
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2020/085380
Kind Code:
A1
Abstract:
The purpose of the present invention is to suppress a decrease in shield effect of a metal layer. An electronic component module (1) is provided with a substrate (2), an electronic component (3), a sealing portion (4), a metal layer (5), and a magnetic layer (6). The substrate (2) has a first main surface (21). The electronic component (3) is disposed on the first main surface (21) of the substrate (2). The sealing portion (4) seals the electronic component (3). The metal layer (5) covers the sealing portion (4). The magnetic layer (6) is disposed between the sealing portion (4) and the metal layer (5). The magnetic layer (6) includes a magnetic body portion (61) and a first cover sheet (62). The first cover sheet (62) is disposed between the magnetic body portion (61) and the metal layer (5). The first cover sheet (62) includes a first main surface (621) and a second main surface (622). The first main surface (621) is opposed to the magnetic body portion (61). The second main surface (622) is opposed to the metal layer (5). The second main surface (622) has a second outer peripheral end portion (624) positioned on the inside of a first outer peripheral end portion (623) of the first main surface (621).
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Inventors:
SHINKAI HIDEKI
Application Number:
PCT/JP2019/041526
Publication Date:
April 30, 2020
Filing Date:
October 23, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K9/00; H01L23/28; H05K3/28
Foreign References:
| JP2017174947A | 2017-09-28 | |||
| JP2002290131A | 2002-10-04 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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