Title:
ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNTED STRUCTURE, AND PROCESS FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2007/007677
Kind Code:
A1
Abstract:
This invention provides a highly reliable electronic component, which does
not cause a lowering in insulating resistance even under high-temperature and
high-humidity conditions and is also excellent in solderability to an external
electrode, and its mounted structure, and a process for producing the electronic
component. The electronic component comprises an electronic component body
(1) and external electrodes (5a, 5b) provided on the surface of the electronic
component body. The external electrode comprises metal-containing substrate
electrode layers (6a, 6b), alloy layers (17a, 17b) provided on the substrate
electrode layers, Ni-plated layers (7a, 7b) provided on the alloy layers, Ni
oxide layers (27a, 27b) provided on the Ni plating layer, and upper plating layers
(8a, 8b) provided on the Ni oxide layers (27a, 27b). The thickness of the Ni oxide
layer is not more than 150 nm, and the average particle diameter of the Ni particles
constituting the Ni plating layer is not less than 2 μm. In the formation
of the Ni plating layer with reduced grain boundaries, heat treatment is carried
out in a reducing atmosphere having an oxygen concentration of not more than 100
ppm at a temperature of 500 to 900ºC.
Inventors:
HORIE SHIGEYUKI (JP)
OTA YUTAKA (JP)
NISHIKAWA JUN (JP)
OTA YUTAKA (JP)
NISHIKAWA JUN (JP)
Application Number:
PCT/JP2006/313589
Publication Date:
January 18, 2007
Filing Date:
July 07, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
HORIE SHIGEYUKI (JP)
OTA YUTAKA (JP)
NISHIKAWA JUN (JP)
HORIE SHIGEYUKI (JP)
OTA YUTAKA (JP)
NISHIKAWA JUN (JP)
International Classes:
H01G4/30; H01C1/142; H01G4/12; H01G4/228; H01G4/232; H01G13/00
Foreign References:
| JPH11111564A | 1999-04-23 | |||
| JPH0935995A | 1997-02-07 | |||
| JPH04334007A | 1992-11-20 | |||
| JP2003077754A | 2003-03-14 |
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi (Daido Seimei Minami-kan 1-2-11, Edobori, Nishi-k, Osaka-shi Osaka 02, JP)
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