Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188066
Kind Code:
A1
Abstract:
This electronic component mounting apparatus (1) includes a bonding head (110) that holds an electronic component (EC) having a mounting surface and mounts the electronic component on a board. The bonding head (110) comprises: a holding tool (111) that has a holding area (111A) for holding the electronic component (EC); a cover (C1) that surrounds the periphery of the holding tool (111) and has an opening portion formed to provide an opening in the cover (C1) on the side closer to the holding area (111A); and a gas spray nozzle (P1) that supplies purge gas to the inside of the cover (C1). A purge gas supply path (R1) is provided around the entire circumference of the holding area (111A) between the cover (C1) and the holding tool (111).
Inventors:
SHIMIZU TAKAHIRO (JP)
SEYAMA KOHEI (JP)
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2022/015830
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H05K3/34; H05K13/04
Foreign References:
| JPH09223868A | 1997-08-26 | |||
| US6015083A | 2000-01-18 | |||
| JPS6349370A | 1988-03-02 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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