Title:
ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/033860
Kind Code:
A1
Abstract:
An electronic component mounting package has a dielectric board disposed between first portions of a pair of signal terminals that protrude from a first surface of a substrate toward one side in a thickness direction, wherein the height of the dielectric board is lower than the height of the first portions. When an electronic component is mounted, bonding wire for electric connection with the electronic component is connected to the tip-ends of the first portions.
More Like This:
| WO/2020/184003 | SEMICONDUCTOR DEVICE AND IMAGE CAPTURE DEVICE |
| WO/2006/014418 | ENCAPSULATED SEMICONDUCTOR DEVICE WITH RELIABLE DOWN BONDS |
| JPH11163182 | ELECTRONIC COMPONENT |
Inventors:
SHIRASAKI TAKAYUKI (JP)
TANIGUCHI MASAHIKO (JP)
MIYAUCHI TAKASHI (JP)
TANIGUCHI MASAHIKO (JP)
MIYAUCHI TAKASHI (JP)
Application Number:
PCT/JP2016/074237
Publication Date:
March 02, 2017
Filing Date:
August 19, 2016
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/04; H01S5/02315; H01S5/0233
Foreign References:
| JP2015122466A | 2015-07-02 | |||
| JP2011171649A | 2011-09-01 | |||
| JP2003037329A | 2003-02-07 |
Other References:
See also references of EP 3343602A4
Download PDF: