Title:
ELECTRONIC COMPONENT-MOUNTING PACKAGE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/054246
Kind Code:
A1
Abstract:
This electronic component-mounting package comprises: a metal substrate having a mounting portion for an electronic component; a frame composed of a member having a coefficient of thermal expansion different from that of the metal substrate, and positioned on the metal substrate; and an interposed member positioned on the metal substrate. The frame has at least a pair of side surface portions spaced apart from each other. The interposed member is positioned between the pair of side surface portions. The mounting portion is surrounded by the frame and the interposed member.
Inventors:
KUBOTA KOJI (JP)
NAKAMOTO SHINJI (JP)
MATSUMOTO TOSHIYUKI (JP)
NAKAMOTO SHINJI (JP)
MATSUMOTO TOSHIYUKI (JP)
Application Number:
PCT/JP2022/035650
Publication Date:
April 06, 2023
Filing Date:
September 26, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/06; H01L23/10; H01L23/12; H05K1/02
Foreign References:
| JPH11274340A | 1999-10-08 | |||
| JP2018121017A | 2018-08-02 | |||
| JP2016072341A | 2016-05-09 | |||
| JP2011044695A | 2011-03-03 | |||
| JP2015084378A | 2015-04-30 | |||
| JP2002076495A | 2002-03-15 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
Download PDF:
Previous Patent: DISPLAY SYSTEM FOR WORK MACHINE AND DISPLAY METHOD FOR WORK MACHINE
Next Patent: PROGRAM, COMPUTER, SYSTEM, AND METHOD
Next Patent: PROGRAM, COMPUTER, SYSTEM, AND METHOD