Title:
ELECTRONIC-COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/068557
Kind Code:
A1
Abstract:
An electronic-component package that keeps a lead member tightly connected to a conductive pad on a substrate is structured in a rational manner. Said electronic-component package comprises the following: the aforementioned substrate, which has a conductive pad as mentioned above and supports an electronic component; the aforementioned lead member, which is electrically connected to the conductive pad; and a molded section in which the substrate and the lead member are embedded. The lead member comprises an internal conductor that has a bifurcated end and a unitary section connected to said internal conductor such that the internal conductor and the unitary section form a single unit. Part of the unitary section of the lead member and the internal conductor, which is embedded inside the abovementioned molded section, are formed so as to be curved in a convex or concave manner with respect to an imaginary plane that extends along the surface of the substrate.
Inventors:
SHINOHARA MINORU (JP)
NAKAMURA NAOKI (JP)
NAKAMURA NAOKI (JP)
Application Number:
PCT/JP2014/077810
Publication Date:
May 14, 2015
Filing Date:
October 20, 2014
Export Citation:
Assignee:
AISIN SEIKI (JP)
International Classes:
H01L23/50; H01L25/04; H01L25/18
Foreign References:
| JPS60236467A | 1985-11-25 | |||
| JPH0290662A | 1990-03-30 | |||
| JPS5298364U | 1977-07-25 | |||
| JPH06181276A | 1994-06-28 | |||
| JPS6218058A | 1987-01-27 | |||
| JPH05121626A | 1993-05-18 | |||
| JPH06140551A | 1994-05-20 | |||
| JPS5124864U | 1976-02-24 | |||
| US4470648A | 1984-09-11 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
Patent business corporation R&C (JP)
Patent business corporation R&C (JP)
Download PDF: