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Title:
ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/046815
Kind Code:
A1
Abstract:
Disclosed is an electronic component packaging sheet comprising a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet comprises: (A) 80,000-220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000-400,000 Mw of a polystyrene resin; and (C) 150,000-210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer comprises: (D) an acrylic copolymer resin; and (E) a polythiophene polymer, particularly a polythiophene polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

Inventors:
FUJIWARA JUMPEI (JP)
OSAWA TOMOHIRO (JP)
KAWATA MASATOSHI (JP)
Application Number:
PCT/JP2011/073125
Publication Date:
April 12, 2012
Filing Date:
October 06, 2011
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
FUJIWARA JUMPEI (JP)
OSAWA TOMOHIRO (JP)
KAWATA MASATOSHI (JP)
International Classes:
B65D65/02; B65D73/02; C08J5/18; C08L25/04; C08L51/04; C08L53/02
Domestic Patent References:
WO2009081963A12009-07-02
WO2010104010A12010-09-16
Foreign References:
JP2010174166A2010-08-12
JP2003055526A2003-02-26
JP2010077294A2010-04-08
JP2006232914A2006-09-07
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
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