Title:
ELECTRONIC COMPONENT PACKAGING SHEET
Document Type and Number:
WIPO Patent Application WO/2024/004973
Kind Code:
A1
Abstract:
Provided is an electronic component packaging sheet with which it is possible to effectively inhibit the occurrence of burrs and fuzz while maintaining good formability. This electronic component packaging sheet comprises a base material sheet obtained by alternately stacking base material layers A and base material layers B. The heat distortion temperature difference between the base material layers A and the base material layers B is more than 0°C and less than 23°C. The thickness of each of the base material layers A is 10-60 µm. The thickness of each of the base material layers B is 1-50 µm. The average value of the thicknesses of each of the base material layers A is greater than the average value of the thicknesses of each of the base material layers B. The base material layers A and the base material layers B include different thermoplastic resins as primary components thereof.
Inventors:
YANAKA RYOSUKE (JP)
INODA IKUKA (JP)
INODA IKUKA (JP)
Application Number:
PCT/JP2023/023695
Publication Date:
January 04, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/00; B32B7/027; B65D85/90
Domestic Patent References:
| WO2011152015A1 | 2011-12-08 | |||
| WO2022149416A1 | 2022-07-14 |
Foreign References:
| JP2015047856A | 2015-03-16 | |||
| JP2021008038A | 2021-01-28 | |||
| JP2002355935A | 2002-12-10 | |||
| JP2015147359A | 2015-08-20 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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