ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SAME, SEALING MATERIAL PASTE, AND FILLER PARTICLES

WIPO Patent Application WO/2014/061515

A1

An electronic component equipped with two substrates, at least either of which is transparent, an organic member disposed therebetween, and a uniting part disposed along the peripheral parts of the two substrates, wherein the uniting part comprises a low-melting glass and filler particles, the low-melting glass containing vanadium oxide and the filler particles comprising a lowly heat-expandable material and an oxide including a divalent transition metal as a constituent element. The oxide has been dispersed in the lowly heat-expandable material, and the lowly heat-expandable material has a coefficient of thermal expansion in the temperature range 30-250ºC of 5×10-7 /ºC or less. Due to this, heating of the filler particles by irradiation with a laser is made possible and an electrical component having a highly reliable uniting part can be obtained.

NAITO TAKASHI (JP)
TACHIZONO SHINICHI (JP)
YOSHIMURA KEI (JP)
HASHIBA YUJI (JP)
AOYAGI TAKUYA (JP)
MIYAGI MASANORI (JP)
KODAMA MOTOMUNE (JP)
SAWAI YUICHI (JP)
FUJIEDA TADASHI (JP)
TSUKAMOTO TAKESHI (JP)
MURAKAMI HAJIME (JP)

PCT/JP2013/077406

April 24, 2014

October 09, 2013

Click for automatic bibliography generation  

HITACHI CHEMICAL CO LTD (JP)

H05B33/04; C03C8/24; C03C27/06; H01L31/042; H01L51/50; H05B33/10

JP2011057477A	2011-03-24
JP2012041196A	2012-03-01

POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)

View/Download PDF      PDF Help

Previous Patent: PNEUMATIC TIRE

Next Patent: METHOD AND DEVICE FOR GENERATION OF CONVERSION MODULE LINKING BETWEEN DIFFERENT ROBOT MIDDLEWARE TYP...