Title:
ELECTRONIC COMPONENT PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/026823
Kind Code:
A1
Abstract:
This electronic component processing device is provided with a conveyance processing unit, a load detection unit, and a controller. The conveyance processing unit is provided with a component retention unit, a supporting unit that supports the component retention unit, a rotation driving unit that rotates the supporting unit, and a displacement driving unit that displaces the component retention unit. The load detection unit detects a load applied to an electronic component. The controller detects contact abnormality with respect to an electronic component.
Inventors:
YODOGAWA YOSHIMASA (JP)
Application Number:
PCT/JP2022/030102
Publication Date:
March 02, 2023
Filing Date:
August 05, 2022
Export Citation:
Assignee:
UENO SEIKI CO LTD (JP)
International Classes:
B65B15/04; B25J13/08; B25J19/06; B65B57/00; H01L21/301; H01L21/677
Domestic Patent References:
| WO2015151896A1 | 2015-10-08 |
Foreign References:
| JP2009136950A | 2009-06-25 | |||
| JP2012148807A | 2012-08-09 | |||
| JP2018092428A | 2018-06-14 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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