Title:
ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/080335
Kind Code:
A1
Abstract:
Provided are an electronic component production method and an electronic component which make it possible to improve sealing of an air cavity. An electronic component production method according to the present invention comprises: a step for mounting at least one electronic member on a circuit board; a step for applying, to an upper surface of the circuit board, a curable composition that is liquid at 23°C and forming a curable composition layer; and a step for curing the curable composition layer and forming an adhesive layer, wherein in the step for forming the curable composition layer, the curable composition layer is formed so as to contact at least part of a side surface of the electronic member, and an air cavity is formed by the circuit board, the electronic member, and the adhesive layer.
Inventors:
SUGISAWA YOSHIFUMI (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
NAGANO SHO (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
NAGANO SHO (JP)
Application Number:
PCT/JP2023/037079
Publication Date:
April 18, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/10; H01L23/02; H01L23/29; H01L23/31; H03H9/25
Domestic Patent References:
| WO2014050688A1 | 2014-04-03 | |||
| WO2022203033A1 | 2022-09-29 |
Foreign References:
| JP2004064732A | 2004-02-26 | |||
| JP2018074566A | 2018-05-10 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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