Title:
ELECTRONIC COMPONENT TRANSFER METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND DEVICE FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/171292
Kind Code:
A1
Abstract:
In the present invention, according to an electronic component transfer method: a step in which a plurality of electronic components 15 held on a first base 20 are received on a first transfer roll 4 and/or a step in which a plurality of electronic components 15 held on the first transfer roll 4 are provided to the second base 30 differentiate(s) the gap between the electronic components 15 in the direction following a second axis X3 of the second base 30 with respect to the gap between the electronic components 15 in the direction following a first axis X1 of the first base 20; and a step in which a plurality of the electronic components 15 held on the second base 30 are received on a second transfer roll 11 and/or a step in which a plurality of the electronic components 15 held on the second transfer roll 11 are provided to a third base 40 differentiate(s) the gap between the electronic components 15 in the direction along a third axis X6 of the third base 40 with respect to the gap between the electronic components 15 in the direction along another axis X4 of the second base 30.
Inventors:
KITAZAWA HIROYUKI (JP)
Application Number:
PCT/JP2023/005458
Publication Date:
September 14, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
SHASHIN KAGAKU CO LTD (JP)
International Classes:
H01L21/52; G09F9/00; G09F9/33; H01L21/50; H01L21/60; H01L21/677; H05K13/04
Foreign References:
| JP6978129B1 | 2021-12-08 | |||
| JP2017175087A | 2017-09-28 | |||
| US20190122917A1 | 2019-04-25 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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