Title:
ELECTRONIC COMPONENT TRANSFERRING ADHESIVE SHEET, AND ELECTRONIC COMPONENT PROCESSING METHOD USING ELECTRONIC COMPONENT TRANSFERRING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/163005
Kind Code:
A1
Abstract:
Provided is an electronic component transferring adhesive sheet that is excellent in both fixing performance and releasing performance with respect to an electronic component, and that enables reception and delivery of the electronic component while preventing problems such as breakage, even if the electronic component is small and/or thin. The electronic component transferring adhesive sheet according to the present invention comprises a substrate and an adhesive layer disposed on at least one side of the substrate, wherein the adhesive layer, after irradiated with ultraviolet rays of 460 mJ/cm2, exhibits a nano indenter elastic modulus of 500 MPa or less at 25 degrees Celsius.
Inventors:
UENO SHUSAKU (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
KATO KAZUMICHI (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2021/034120
Publication Date:
August 04, 2022
Filing Date:
September 16, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/52; C09J7/25; C09J7/38
Domestic Patent References:
| WO2020162331A1 | 2020-08-13 |
Foreign References:
| JP2020061423A | 2020-04-16 | |||
| JP2013072036A | 2013-04-22 | |||
| JP2003007986A | 2003-01-10 | |||
| JP2004273596A | 2004-09-30 | |||
| JP2019138949A | 2019-08-22 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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