Title:
ELECTRONIC COMPONENT UNIT AND HEAT CONDUCTIVE PLACEMENT MEMBER
Document Type and Number:
WIPO Patent Application WO/2017/098621
Kind Code:
A1
Abstract:
An electronic component unit of the present invention has: a heat sink (300); a first electronic component (100), which is provided upright with respect to the heat sink (300), and extending in the first direction; and a heat conductive placement member (10) for conducting, to the heat sink (300), heat generated from the first electronic component (100). The heat conductive placement member (10) has: a contact section (20) in contact with the heat sink (300); a first extending section (31) extending in the first direction from the contact section (20); and a second extending section (32), which is disposed to face the first extending section (31), and extending in the first direction from the contact section (20). The first electronic component (100) is sandwiched between the first extending section (31) and the second extending section.
Inventors:
IKEDA KOSUKE (JP)
MATSUZAKI OSAMU (JP)
MATSUZAKI OSAMU (JP)
Application Number:
PCT/JP2015/084595
Publication Date:
June 15, 2017
Filing Date:
December 10, 2015
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H05K7/20; H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| WO2015111211A1 | 2015-07-30 |
Foreign References:
| JP2008192657A | 2008-08-21 | |||
| JP2012134200A | 2012-07-12 | |||
| JP2012110207A | 2012-06-07 | |||
| JPH01174990U | 1989-12-13 |
Attorney, Agent or Firm:
OHNO, Seiji et al. (JP)
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