Title:
ELECTRONIC COMPONENT UNIT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT UNIT
Document Type and Number:
WIPO Patent Application WO/2023/238605
Kind Code:
A1
Abstract:
An electronic component unit (1) comprises: a substrate (2) on which an electronic component (3) is mounted; a bracket (10) which includes a base (11), two or more holder sections (12a, 12b) one end of which is continuous with the base (11) and which hold the substrate (2) at the other end thereof to dispose the substrate (2) in a spaced-apart position with respect to the base (11), the bracket (10) further including a front mounting section (13) and a rear mounting section (14) respectively protruding from the front and rear of the base (11) forwardly and rearwardly of the base (11); and a resin case (17) encapsulating the substrate (2), the base (11), and the holder sections (12a, 12b). The front mounting section (13) and the rear mounting section (14) protrude outside the resin case (17).
Inventors:
TAKEUCHI SATOSHI (JP)
Application Number:
PCT/JP2023/018079
Publication Date:
December 14, 2023
Filing Date:
May 15, 2023
Export Citation:
Assignee:
KYB CORP (JP)
International Classes:
H05K5/00; B60R16/02; H05K7/14
Domestic Patent References:
| WO2017056728A1 | 2017-04-06 |
Foreign References:
| JPS55120197U | 1980-08-26 | |||
| JP2016207705A | 2016-12-08 | |||
| JP2010232207A | 2010-10-14 |
Attorney, Agent or Firm:
ISHIKAWA Ken (JP)
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