Title:
ELECTRONIC COMPONENT WIRING STRUCTURE, AND ELECTRONIC COMPONENT CONNECTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/233893
Kind Code:
A1
Abstract:
[Problem] To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. [Solution] This electronic component wiring structure is characterized in that a flexible wiring body 4 in which a conductive wiring portion 411 is formed on a flexible insulating base material 40 is interposed between a substrate 2 and an electronic component 3 installed on the substrate 2, the wiring portion 411 and the electronic component 3 being electrically connected to each other.
Inventors:
MAEDA SHINICHI (JP)
MIYASATO KEITA (JP)
MIYASATO KEITA (JP)
Application Number:
PCT/JP2023/016798
Publication Date:
December 07, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
MAEDA SHINICHI (JP)
KEITA SMART FUTURE CREATIONS INC (JP)
KEITA SMART FUTURE CREATIONS INC (JP)
International Classes:
H05K1/14; H05K1/18; H05K3/36
Domestic Patent References:
| WO2017119248A1 | 2017-07-13 | |||
| WO2021095642A1 | 2021-05-20 | |||
| WO2017051649A1 | 2017-03-30 |
Foreign References:
| JP2017157807A | 2017-09-07 | |||
| US20020079568A1 | 2002-06-27 | |||
| JP2004221222A | 2004-08-05 | |||
| JP2021002628A | 2021-01-07 |
Attorney, Agent or Firm:
ABIKO Gen (JP)
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