Title:
ELECTRONIC COMPONENT WIRING STRUCTURE, AND ELECTRONIC COMPONENT CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/101348
Kind Code:
A1
Abstract:
[Problem] To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. [Solution] An electronic component wiring structure 1 is characterized in that a flexible wiring body 4 which is flexible and has a conductive wiring portion formed thereon is disposed on a surface of a first electronic component 31 which is installed on a substrate 2, the flexible wiring body 4 being spaced apart from the substrate 2, wherein the wiring portion of the flexible wiring body 4 is electrically connected to the first electronic component 31. In the electronic component wiring structure 1, a second electronic component is disposed on the first electronic component 31 with the flexible wiring body 4 therebetween, the wiring portion of the flexible wiring body 4 being electrically connected to the second electronic component. A plurality of flexible wiring bodies 4 are laminated, the wiring portion of each of the flexible wiring bodies 4 being electrically connected to one first electronic component 31.
Inventors:
MAEDA SHINICHI (JP)
MIYASATO KEITA (JP)
MIYASATO KEITA (JP)
Application Number:
PCT/JP2023/040031
Publication Date:
May 16, 2024
Filing Date:
November 07, 2023
Export Citation:
Assignee:
MAEDA SHINICHI (JP)
KEITA SMART FUTURE CREATIONS INC (JP)
KEITA SMART FUTURE CREATIONS INC (JP)
International Classes:
H05K1/14; H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| WO2021095642A1 | 2021-05-20 | |||
| WO2018212000A1 | 2018-11-22 |
Foreign References:
| JP2006344789A | 2006-12-21 | |||
| JP2006147886A | 2006-06-08 | |||
| JPH06268365A | 1994-09-22 | |||
| JP2000269667A | 2000-09-29 | |||
| JP2020202241A | 2020-12-17 | |||
| US20110075393A1 | 2011-03-31 | |||
| US20140273552A1 | 2014-09-18 |
Attorney, Agent or Firm:
ABIKO Gen (JP)
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