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Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/120968
Kind Code:
A1
Abstract:
Provided is an electronic component whereby it is possible to alleviate collapse of a space which is disposed above a surface elastic wave element. A support layer (14) surrounds an element region (E) upon a primary face (S1) of a piezoelectric substrate (12) when seen in plan view in the z-axis direction. A surface elastic wave element (18) is disposed within the element region (E). A cover layer (20) is disposed upon the support layer (14) and is opposite the primary face (S1). A support member (16) joins the primary face (S1) and the cover layer (20) and does not make contact with the support layer (14) in a space (Sp) surrounded by the primary face (S1), the support layer (14), and the cover layer (20).

Inventors:
YAMATO SYUJI (JP)
HIRA MITSUYOSHI (JP)
Application Number:
PCT/JP2012/053101
Publication Date:
September 13, 2012
Filing Date:
February 10, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
YAMATO SYUJI (JP)
HIRA MITSUYOSHI (JP)
International Classes:
H03H9/25; H01L23/02; H03H9/64
Foreign References:
JP2001094390A2001-04-06
JP2004129223A2004-04-22
JP2009278016A2009-11-26
JP2010245704A2010-10-28
JP2010278972A2010-12-09
JP2009218762A2009-09-24
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
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Claims: