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Patent Searching and Data


Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/014212
Kind Code:
A1
Abstract:
An electronic component (101) according to the present invention is provided with: a substrate (1); an insulator layer (2) which expands along a surface of the substrate (1); a planar conductor (4) which is formed on the substrate (1) or in the insulator layer (2) and planarly expands so as to be parallel to the surface of the substrate (1); and a conductor pattern (5) for inductors, the conductor pattern (5) being formed on the insulator layer (2) or in the insulator layer (2). When viewed from a direction that is perpendicular to the surface of the substrate (1), if Ls is the length in the longitudinal direction of a region where the formation region of the conductor pattern (5) for inductors and the planar conductor (4) overlap with each other, and d is the distance between the conductor pattern (5) for inductors and the planar conductor (4), the value of Ls/d is 1 to 60.

Inventors:
MIZUNO TAKAAKI (JP)
NAKAISO TOSHIYUKI (JP)
TOYOSHIMA KENJI (JP)
YOSHIOKA YOSHIMASA (JP)
Application Number:
PCT/JP2023/021861
Publication Date:
January 18, 2024
Filing Date:
June 13, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/00; H01F17/00; H01G4/40; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
WO2015037374A12015-03-19
Foreign References:
JP2005020577A2005-01-20
JP2019186696A2019-10-24
JP2011233807A2011-11-17
JP2010239380A2010-10-21
JP2003249832A2003-09-05
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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