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Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/018792
Kind Code:
A1
Abstract:
The present invention comprises: a plate-shaped board body that has an upper main plane and a lower main plane; and one or more external electrodes that are provided on the lower main plane of the board body. A plane of the board body that is located centrally in the up-down direction is defined as a central plane. The central plane is curved such that the central part of the central plane is located above or below the left end of the central plane and the right end of the central plane when viewed in the front-back direction. The lower main plane, when viewed in the front-back direction, has: one or more first inclination regions in which the lower main plane inclines relative to the right-left direction; and one or more adjacent regions that are adjacent to the one or more first inclination regions. Each of the one or more adjacent regions has an area greater than zero and is not located below the lower ends of the one or more first inclination regions.

Inventors:
MATSUSHITA YOSUKE (JP)
IMAMURA MITSUTOSHI (JP)
Application Number:
PCT/JP2023/022374
Publication Date:
January 25, 2024
Filing Date:
June 16, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H01F27/06; H01F27/30; H03H7/01
Domestic Patent References:
WO2018180178A12018-10-04
WO2018216452A12018-11-29
Foreign References:
JP2008005329A2008-01-10
JP2005101467A2005-04-14
JP2009054743A2009-03-12
JP2003218150A2003-07-31
JP2021034665A2021-03-01
JP2019125607A2019-07-25
JPH1065338A1998-03-06
JP2009141092A2009-06-25
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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