Title:
ELECTRONIC CONTROL APPARATUS MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/076050
Kind Code:
A1
Abstract:
Provided is an electronic control apparatus mounting structure, which improves heat dissipating characteristics of an electronic component that does not have a heat dissipating structure, and which has excellent mass productivity.
An electronic control apparatus of the present invention is configured from: a wiring board that is provided with a through hole; an electronic component, which is mounted on a first surface of the wiring board, and which has lead terminals protruding in one direction, said lead terminals being electrically connected to the wiring board; and a heat dissipating member, which is mounted on a second surface of the wiring board, said second surface being on the reverse side of the first surface, and which is attached in a state wherein the heat dissipating member faces the electronic component and the through hole. The electronic control apparatus is provided with: a heat dissipating adhesive material covering the lead terminals of the electronic component; and a filling material, with which the through hole is filled, said filling material having high heat conductivity. The heat dissipating adhesive material is in contact with the filling material, and furthermore, a heat dissipating path from the lead terminals to the heat dissipating member is provided by bringing the heat dissipating adhesive material into thermally contact with the heat dissipating member.
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Inventors:
TAKASE KOUSUKE (JP)
Application Number:
PCT/JP2014/078010
Publication Date:
May 28, 2015
Filing Date:
October 22, 2014
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K7/20; H05K1/02; H05K1/18; H05K3/34
Foreign References:
| JPS57134953A | 1982-08-20 | |||
| JP2013012649A | 2013-01-17 | |||
| JPH03128965U | 1991-12-25 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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