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Patent Searching and Data


Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/047810
Kind Code:
A1
Abstract:
The purpose of the present invention is to reliably take countermeasures against heat for electronic components mounted on a plurality of circuit boards provided to an electronic control device. An electronic control device 100 comprises: a first circuit board 4 and a second circuit board 5 that are disposed such that respective mounting surfaces 4a, 5a thereof, on which electronic components 8 are mounted, are disposed to be opposite to each other with a gap therebetween; a heat dissipation plate 15 disposed between the electronic components 8 that are mounted on the first circuit board 4 and the electronic components 8 that are mounted on the second circuit board 5; heat dissipation materials 18 that come into contact with the electronic components 8 and the heat dissipation plate 15; housings 1, 2 that accommodate the first circuit board 4, the second circuit board 5, the heat dissipation plate 15, and the heat dissipation materials 18; and a heat sink 17 provided outside the housings 1, 2. The heat dissipation plate 15 is connected to the heat sink 17 by penetrating through, or having interposed therebetween, the housings 1, 2.

Inventors:
TAKII AKIRA (JP)
TAKAI TOSHIAKI (JP)
NAKAMURA YUKI (JP)
Application Number:
PCT/JP2022/032831
Publication Date:
March 07, 2024
Filing Date:
August 31, 2022
Export Citation:
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Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H05K7/20; H05K9/00
Domestic Patent References:
WO2016163135A12016-10-13
Foreign References:
JPS5379269A1978-07-13
JPS6367800A1988-03-26
JP2016059167A2016-04-21
JP2018513561A2018-05-24
JP2001257491A2001-09-21
JPH01165693U1989-11-20
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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