ELECTRONIC DEVICE ASSEMBLY APPARATUS AND ELECTRONIC DEVICE ASSEMBLY METHOD

WIPO Patent Application WO/2023/276726

A1

An electronic device assembly apparatus (100) comprises a robot control apparatus (114) for controlling the operation of: a gripping apparatus (126) for gripping a cable (104) which is flat and flexible and has a distal end (106) that is a free end; and a robot arm (124) for moving the gripping apparatus (126). The robot control apparatus (114): causes the gripping apparatus (126) to move so that a pressing surface (140) of the gripping apparatus (126) is pressed onto one surface (174) of the cable (104); with gripping claws (142, 144) of the gripping apparatus (126) and an attraction hole (146) being in a non-operation state, causes the pressing surface (140) to slide toward the distal end (106) of the cable (104), while causing the cable (104) to bend; after the sliding, causes the cable (104) to be chucked by the gripping claws (142, 144) sandwiching the cable (104) in a width direction; corrects misalignment of the cable (104) in the width direction; after the chucking, causes the one surface (174) of the cable (104) to be attracted onto the attraction hole (146); and causes the gripping apparatus (126) to move so as to insert the distal end (106) of the cable (104) into a connector (110) of a circuit substrate (108) to be connected to.

UCHIJIMA DAISAKU (JP)
MIKAMI KEI (JP)
MIMURA KYOTARO (JP)

PCT/JP2022/024312

January 05, 2023

June 17, 2022

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NACHI FUJIKOSHI CORP (JP)

H01R43/26

JP2018107068A	2018-07-05
JP2019029190A	2019-02-21
JP2018069415A	2018-05-10
JP2018134688A	2018-08-30
JP2019018301A	2019-02-07

HIDA, Kosuke (JP)

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