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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING ACOUSTIC MODULE
Document Type and Number:
WIPO Patent Application WO/2024/071734
Kind Code:
A1
Abstract:
An electronic device according to an embodiment may comprise: a housing including a front side, a back side opposite to the front side, and a lateral side surrounding the internal space between the front side and the back side, the housing having an acoustic hole formed therein to transmit sound from the outside to the internal space; a display visually exposed to the outside through the front side; a front frame disposed in the internal space and having formed therein an acoustic duct which communicates with the acoustic hole and through which the sound can move; a printed circuit board disposed in the internal space and including a first substrate surface, a second substrate surface opposite to the first substrate surface and facing the front frame, and an opening formed through to overlap the acoustic duct in a direction toward the first substrate surface; an acoustic module disposed on the first substrate surface and including a microphone positioned to overlap the opening in the direction toward the first substrate surface; and a waterproof assembly which is disposed between the printed circuit board and the front frame to overlap the opening in the direction toward the first substrate surface and is configured to transmit sound to the microphone from the acoustic duct through the opening. The waterproof assembly may include a vibrating membrane for transmitting sound through vibration, a first sealing member disposed on the vibrating membrane to face the printed circuit board and formed of a compressible material, and a second sealing member disposed between the vibrating membrane and the first sealing member and formed of a compressible material. The first sealing member and the second sealing member may have different physical properties.

Inventors:
RYU HEEJUN (KR)
GO KWANGEUN (KR)
KOO SUNGKEUN (KR)
YEON DONGJU (KR)
Application Number:
PCT/KR2023/013566
Publication Date:
April 04, 2024
Filing Date:
September 11, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/16; H04R1/28
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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