Title:
ELECTRONIC DEVICE COMPRISING BRIDGE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/172051
Kind Code:
A1
Abstract:
According to various embodiments, an electronic device may comprise: a first printed circuit board including a main hole; a second printed circuit board inserted into the main hole and encompassed by the first printed circuit board; a bridge printed circuit board, which connects the first printed circuit board and the second printed circuit board, is overlapped with each of the first printed circuit board and the second printed circuit board and includes a bridge hole; an application processor disposed on the second printed circuit board, inserted into the bridge hole and encompassed by the bridge printed circuit board; and a main shield, which is connected to the bridge printed circuit board and covers the application processor. Other various embodiments are possible.
Inventors:
MIN BONGKYU (KR)
KIM TAEWOO (KR)
PARK JINYONG (KR)
YUN HYELIM (KR)
LEE HYEONGJU (KR)
KIM TAEWOO (KR)
PARK JINYONG (KR)
YUN HYELIM (KR)
LEE HYEONGJU (KR)
Application Number:
PCT/KR2023/003141
Publication Date:
September 14, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/14; H01Q1/24; H01Q1/38; H04M1/02; H05K1/18; H05K9/00
Foreign References:
| KR20190110901A | 2019-10-01 | |||
| KR20200044413A | 2020-04-29 | |||
| KR20200032911A | 2020-03-27 | |||
| JP2016082021A | 2016-05-16 | |||
| US20210307218A1 | 2021-09-30 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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