Title:
ELECTRONIC DEVICE COMPRISING CONDUCTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2024/058517
Kind Code:
A1
Abstract:
An electronic device comprising a conductive layer is disclosed. The electronic device according to various embodiments of the present invention may comprise: a printed circuit board in which at least one electrical constituent element and a plurality of wirings connected to the electrical constituent element are arranged on a first surface facing a first direction; a wiring exposure part in which at least one from among the plurality of wirings is exposed on a lateral surface, which is the surface facing the direction perpendicular to the first direction of the printed circuit board; and a conductive layer in electrical contact with the wiring exposure part.
Inventors:
KANG TAEHOON (KR)
KIM HYUKSU (KR)
PARK JINYOUNG (KR)
KIM HYUKSU (KR)
PARK JINYOUNG (KR)
Application Number:
PCT/KR2023/013593
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; G04G17/04; G04G17/06; G04G21/04; G04G99/00; G06F1/16; H01Q1/24; H01Q1/38; H05K1/11; H05K3/28
Foreign References:
| KR20120043503A | 2012-05-04 | |||
| JP6555501B1 | 2019-08-07 | |||
| US20130187818A1 | 2013-07-25 | |||
| JP2021136514A | 2021-09-13 | |||
| KR20100128108A | 2010-12-07 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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