Title:
ELECTRONIC DEVICE COMPRISING GROUND REINFORCEMENT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/085639
Kind Code:
A1
Abstract:
An electronic device according to an embodiment of the present invention can comprise: a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member covering at least a part of the space between the first and second plates; a display arranged to be exposed in at least a part of the first plate; a first circuit board which includes a first surface facing the first direction and a second surface facing the second direction, and which is arranged in the second direction of the display; a second circuit board which is arranged so that at least a part thereof is not overlapped with the first circuit board, and which is electrically connected to the first circuit board; a socket mounted on the second circuit board; at least one metal structure arranged on the first circuit board so as to transfer, to other components, the heat of at least one heating component mounted on the first circuit board; and a ground path formed in at least a part of the second circuit board so as to be electrically connected to the first circuit board or the metal member or the first circuit board and the metal structure.
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Inventors:
PARK MINKI (KR)
Application Number:
PCT/KR2019/011234
Publication Date:
April 30, 2020
Filing Date:
September 02, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H01R13/648; H05K5/00; H05K7/20; H05K9/00
Foreign References:
| KR20180115153A | 2018-10-22 | |||
| KR20100125081A | 2010-11-30 | |||
| KR20020064416A | 2002-08-09 | |||
| KR20180109444A | 2018-10-08 | |||
| US20160037623A1 | 2016-02-04 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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