Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/139554
Kind Code:
A1
Abstract:
A wearable electronic device according to one embodiment of the present invention comprises: a housing; a first printed circuit board (PCB); a second PCB disposed parallel to the first PCB; a first interposer; and a second interposer. The housing may include at least one first opening in a first portion. The first interposer and the second interposer are disposed between the first PCB and the second PCB. The first interposer and the second interposer are disposed such that a first end of the first interposer and a second end of the second interposer facing the first end are spaced apart from each other by at least a predetermined distance. A first space between the first end and the second end may be connected to the at least one first opening of the housing. Various other embodiments may be possible.
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Inventors:
UHM JUNWHON (KR)
YANG HYUNMO (KR)
YANG SUNGKWANG (KR)
YOON JONGMIN (KR)
YANG HYUNMO (KR)
YANG SUNGKWANG (KR)
YOON JONGMIN (KR)
Application Number:
PCT/KR2021/019859
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H05K1/02; H05K1/11; H05K1/14
Domestic Patent References:
| WO2020171246A1 | 2020-08-27 |
Foreign References:
| KR20190029215A | 2019-03-20 | |||
| US10579114B1 | 2020-03-03 | |||
| US6618267B1 | 2003-09-09 | |||
| US20190051615A1 | 2019-02-14 |
Other References:
See also references of EP 4243583A4
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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