Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/173139
Kind Code:
A1
Abstract:
According to various embodiments, an electronic device may comprise: a housing; a support member, which is disposed in the inner space of the housing, includes a first surface and a second surface oriented in the direction opposite to the first surface, and at least partially includes at least one through hole; a first heat dissipation member, which corresponds to at least a part of the first surface in the inner space and is disposed to at least partially overlap the at least one through hole when the first surface is viewed from above; a second heat dissipation member, which corresponds to at least a part of the second surface in the inner space and is disposed to at least partially overlap the at least one through hole when the first surface is viewed from above; and a heat transfer member, which is disposed in the at least one through hole and thermally connects the first heat dissipation member and the second heat dissipation member.
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Inventors:
YEO MOONKI (KR)
PARK MIN (KR)
JO JEONGGYU (KR)
PARK MIN (KR)
JO JEONGGYU (KR)
Application Number:
PCT/KR2022/000960
Publication Date:
August 18, 2022
Filing Date:
January 19, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H04M1/02; H05K5/00
Foreign References:
| JP2015015545A | 2015-01-22 | |||
| JP5939102B2 | 2016-06-22 | |||
| KR20160128950A | 2016-11-08 | |||
| KR20150100472A | 2015-09-02 | |||
| US20150005043A1 | 2015-01-01 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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