Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER
Document Type and Number:
WIPO Patent Application WO/2024/035235
Kind Code:
A1
Abstract:
An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge structure connected to the first housing and the second housing to enable the first housing and the second housing to be rotated while the electronic device changes the state thereof between an unfolded state and a folded state; a flexible display accommodated in the first housing and the second housing and located to be unfolded or bent while the state of the electronic device changes between the unfolded state and the folded state; and a heat dissipation member (310) including a first area (S1) located to overlap at least a portion of the first housing when viewed in a direction perpendicular to the first housing, and a second area (S2) extending from the first area and located to overlap at least a portion of the second housing when viewed in a direction perpendicular to the second housing. When the state of the electronic device changes between the unfolded state and the folded state, the first area of the heat dissipation member may be fixed to the first housing or at least one part accommodated in the first housing, and the second area may be located to slide relative to the second housing.
Inventors:
MIN BYEONGUK (KR)
Application Number:
PCT/KR2023/012005
Publication Date:
February 15, 2024
Filing Date:
August 11, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; G06F1/16; H04M1/02; H05K5/06
Foreign References:
| KR20200129872A | 2020-11-18 | |||
| KR20210088971A | 2021-07-15 | |||
| KR20220105483A | 2022-07-27 | |||
| KR20200070336A | 2020-06-17 | |||
| US20210109576A1 | 2021-04-15 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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