Title:
ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/080652
Kind Code:
A1
Abstract:
An electronic device according to an embodiment of the present disclosure comprises: a heating unit including an electronic component in which heat is generated during the operation of the electronic device; and a heat dissipation structure that supports the heating unit, wherein the heat dissipation structure includes a first frame including a first metal, and a second frame, at least a portion of which is disposed inside the first frame, at least a portion of which is exposed to the outside through one surface of the first frame, and which includes a second metal, and the second frame includes a heat transfer part that is in contact with the heating unit and a heat dissipation part that is disposed at a distance from the heating unit, and may extend from the heat transfer part to the heat dissipation part.
Inventors:
KIM MINUK (KR)
Application Number:
PCT/KR2023/015132
Publication Date:
April 18, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; B22D17/00; B22D17/22; B22D21/00; H05K9/00
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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