Title:
ELECTRONIC DEVICE COMPRISING HEAT SINK AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/053837
Kind Code:
A1
Abstract:
An electronic device according to an embodiment may comprise: a substrate; a first integrated circuit connected to the substrate; a second integrated circuit connected to the substrate via the first integrated circuit and arranged over one surface of the first integrated circuit while being spaced apart therefrom; a connection member provided between the first integrated circuit and the second integrated circuit and electrically connecting the first integrated circuit and the second integrated circuit to each other; and a heat sink provided between the first integrated circuit and the second integrated circuit and including an opening surrounding the connection member.
Inventors:
KWAK DONGYEOL (KR)
PARK WOOCHUL (KR)
KIM JUHO (KR)
KIM JUWON (KR)
JO WONBIN (KR)
PARK WOOCHUL (KR)
KIM JUHO (KR)
KIM JUWON (KR)
JO WONBIN (KR)
Application Number:
PCT/KR2023/009747
Publication Date:
March 14, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H01L21/48; H01L23/10; H01L23/367; H01L23/42; H01L23/552; H01L25/00; H01L25/065; H05K9/00
Foreign References:
| KR20140147368A | 2014-12-30 | |||
| KR20060004789A | 2006-01-16 | |||
| KR20130115456A | 2013-10-22 | |||
| US20130277821A1 | 2013-10-24 | |||
| JP2014063984A | 2014-04-10 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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