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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING HOUSING INCLUDING INSULATION UNIT, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/027484
Kind Code:
A1
Abstract:
An electronic device comprising a housing including an insulation unit, and a manufacturing method therefor are disclosed. The electronic device according to various embodiments of the present invention comprises a housing, wherein the housing includes: a plurality of metallic areas including surface treatment layers formed on a surface exposed to the outer surface of the electronic device; and an insulation area, which is exposed to the outer surface of the electronic device, is positioned between the metallic areas, is coupled to the metallic areas, and includes a synthetic resin material, wherein the insulation area can comprise a coating layer, which is formed on the surface exposed to the outer surface of the electronic device in the insulation area and includes a polymer matrix and a siloxane-based component.

Inventors:
HWANG HANGYU (KR)
LEE YOONHEE (KR)
Application Number:
PCT/KR2022/012606
Publication Date:
March 02, 2023
Filing Date:
August 23, 2022
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/00; H05K5/04
Foreign References:
KR101695709B12017-01-12
KR20190133656A2019-12-03
KR20200043454A2020-04-27
KR20150064182A2015-06-10
JP2001088247A2001-04-03
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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