Title:
ELECTRONIC DEVICE COMPRISING HOUSING
Document Type and Number:
WIPO Patent Application WO/2024/058643
Kind Code:
A1
Abstract:
In an electronic device comprising a housing, according to various embodiments of the present disclosure, the housing may comprise: an aluminum substrate; a thermal spray coating layer formed on the aluminum substrate and including a first region having a first thickness and a second region having a second thickness thinner than the first thickness; an oxide film layer formed on the thermal spray coating layer or the aluminum substrate; and a deposited film layer formed on at least a portion of the thermal spray coating layer.
Inventors:
SON KIDOC (KR)
SONG KYUNGHWAN (KR)
CHOI HYUNSUK (KR)
KIM YOUNGCHUN (KR)
KIM TAEJEONG (KR)
PARK BYOUNGGYU (KR)
LEE HYUCKKI (KR)
SONG KYUNGHWAN (KR)
CHOI HYUNSUK (KR)
KIM YOUNGCHUN (KR)
KIM TAEJEONG (KR)
PARK BYOUNGGYU (KR)
LEE HYUCKKI (KR)
Application Number:
PCT/KR2023/014100
Publication Date:
March 21, 2024
Filing Date:
September 18, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/04; C23C4/18; C23C14/04; C23C28/00; C25D11/04; H04M1/02; H05K5/00
Foreign References:
| KR20190080925A | 2019-07-08 | |||
| KR20140138329A | 2014-12-03 | |||
| KR20140112325A | 2014-09-23 | |||
| JP2011149038A | 2011-08-04 | |||
| KR20150143287A | 2015-12-23 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
Download PDF: