ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD

Title:

ELECTRONIC DEVICE COMPRISING INTERPOSER SURROUNDING CIRCUIT ELEMENTS DISPOSED ON PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2020/060240

Kind Code:

A1

Abstract:

Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.

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Inventors:

YUN HYELIM (KR)
MIN BONGKYU (KR)
KIM DOHOON (KR)
KIM TAEWOO (KR)
PARK JINYONG (KR)
BANG JUNGJE (KR)
LEE HYEONGJU (KR)

Application Number:

PCT/KR2019/012165

Publication Date:

March 26, 2020

Filing Date:

September 19, 2019

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K9/00; H05K1/11

Foreign References:

US20120243195A1	2012-09-27
US20180070484A1	2018-03-08
US20170020035A1	2017-01-19
US20070178763A1	2007-08-02
JP2017220654A	2017-12-14

Other References: