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Patent Searching and Data


Title:
ELECTRONIC DEVICE COMPRISING INTERPOSING BOARD FOR ANTENNA
Document Type and Number:
WIPO Patent Application WO/2023/287216
Kind Code:
A1
Abstract:
The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). According to embodiments of the present disclosure, a radio unit (RU) module comprises:: a first printed circuit board (PCB) on which a plurality of antenna elements is arranged; a second PCB on which a radio frequency integrated circuit (RFIC) is arranged; and a third PCB electrically connecting each of the plurality of antenna elements arranged on the first PCB to the RFIC arranged on the second PCB, wherein the third PCB is smaller than the first PCB and larger than the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, the positions of feeding ports on the first surface of the third PCB can correspond to the positions of the ports of the plurality of antenna elements arranged on a second surface that is opposite the first surface of the first PCB.

Inventors:
LEE JUNESEOK (KR)
BAEK KWANGHYUN (KR)
HA DOHYUK (KR)
PARK JUNGHO (KR)
LEE SANGHO (KR)
LEE YOUNGJU (KR)
LEE WUSEONG (KR)
Application Number:
PCT/KR2022/010274
Publication Date:
January 19, 2023
Filing Date:
July 14, 2022
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01Q1/38; H01Q1/24
Foreign References:
US20200137884A12020-04-30
US20210044026A12021-02-11
KR20190073856A2019-06-27
KR20190043328A2019-04-26
US20180159203A12018-06-07
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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