Title:
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/157901
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure may comprise: a microphone module; and a printed circuit board on which the microphone module is disposed, wherein the printed circuit board may comprise: a first layer comprising at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and comprising a second ground opposite to the first microphone pad and at least a part of the first ground.
Inventors:
PARK HAEKEU (KR)
JEONG HYEONYEONG (KR)
CHO SUNGHOON (KR)
JEONG HYEONYEONG (KR)
CHO SUNGHOON (KR)
Application Number:
PCT/KR2021/000683
Publication Date:
August 12, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/02; H04R1/10; H05K9/00
Foreign References:
| KR101437505B1 | 2014-09-05 | |||
| KR20070029621A | 2007-03-14 | |||
| KR101688142B1 | 2016-12-20 | |||
| KR101561912B1 | 2015-10-20 | |||
| US20190260111A1 | 2019-08-22 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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