Title:
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/256742
Kind Code:
A1
Abstract:
An electronic device according to an embodiment may comprise a first printed circuit board including a specified area. The first printed circuit board may comprise at least one first pad and at least one second pad formed in the specified area, wherein when a first radio frequency (RF) front end module is disposed in the specified area of the first printed circuit board, at least one first pad is in contact with the first RF front end module and at least one second pad is not in contact with the first RF front end module, and when a second RF front end module is disposed in the specified area of the first printed circuit area, at least one first pad and at least one second pad are in contact with the second RF front end module. Other embodiments may be possible.
Inventors:
KIM JUNGJOON (KR)
CHOI HYUNSEOK (KR)
NA HYOSEOK (KR)
CHOI HYUNSEOK (KR)
NA HYOSEOK (KR)
Application Number:
PCT/KR2021/006883
Publication Date:
December 23, 2021
Filing Date:
June 02, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/11; H04M1/02; H05K1/02; H05K3/34; H05K5/00
Foreign References:
| JPH10294553A | 1998-11-04 | |||
| KR20160120496A | 2016-10-18 | |||
| KR20130042312A | 2013-04-26 | |||
| KR20170037457A | 2017-04-04 | |||
| JP2020057708A | 2020-04-09 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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