Title:
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD STRUCTURE ACCOMMODATING THERMAL INTERFACE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/085607
Kind Code:
A1
Abstract:
According to various embodiments, an electronic device may comprise: a base plate (24); a first component (27) disposed on the base plate; a second component (28) which is disposed on the base plate and provided at a position spaced apart from the first component; an interposer (23) which is connected to the base plate and surrounds the first component and the second component; a cover plate (22) comprising a cover plate body (221) which is connected to the interposer and covers the first component and the second component, and a cover hole (222) which is formed to penetrate the cover plate body; and a heat dissipation plate (21) comprising a heat dissipation plate body (211) which is disposed on the cover plate body and faces the first component and the second component, a heat dissipation hole (21a) which is formed to penetrate the heat dissipation plate body and communicates with the cover hole, and a flow guide (212) which is formed on the heat dissipation plate body and guides the flow of a thermal interface material. Various other embodiments are possible.
Inventors:
MIN BONGKYU (KR)
KIM TAEWOO (KR)
PARK JINYONG (KR)
YUN HYELIM (KR)
LEE HYEONGJU (KR)
HAN JISEON (KR)
KIM TAEWOO (KR)
PARK JINYONG (KR)
YUN HYELIM (KR)
LEE HYEONGJU (KR)
HAN JISEON (KR)
Application Number:
PCT/KR2022/014790
Publication Date:
May 19, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G06F1/20; G06F1/16; H05K7/20
Domestic Patent References:
| WO2020199043A1 | 2020-10-08 |
Foreign References:
| US9806002B2 | 2017-10-31 | |||
| JP5808227B2 | 2015-11-10 | |||
| US8115301B2 | 2012-02-14 | |||
| KR101301782B1 | 2013-08-29 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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