Title:
ELECTRONIC DEVICE COMPRISING THERMAL MANAGEMENT CHAMBER USING BOILING
Document Type and Number:
WIPO Patent Application WO/2022/215902
Kind Code:
A1
Abstract:
An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display located on the housing so as to be on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and far away from the heat source, and having a second hydrophobic surface; and a plurality of third walls located between the first wall and the second wall. Various other embodiments are possible.
Inventors:
AHN JOSEPH (KR)
KOO KYUNGHA (KR)
MOON HONGKI (KR)
KOO KYUNGHA (KR)
MOON HONGKI (KR)
Application Number:
PCT/KR2022/003926
Publication Date:
October 13, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; F28D15/02; H04M1/02; H05K5/00
Foreign References:
| JP6353682B2 | 2018-07-04 | |||
| JP2014192346A | 2014-10-06 | |||
| JP3170057U | 2011-09-01 | |||
| KR101934847B1 | 2019-01-03 | |||
| JP2009069230A | 2009-04-02 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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