Title:
ELECTRONIC DEVICE HAVING SHIELDING STRUCTURE AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/150041
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure comprises: a printed circuit board; at least one electrical element disposed on one surface facing a first direction perpendicular to the printed circuit board; a shield can mounted on the one surface of the printed circuit board to accommodate the electric element therein, and including at least one opening formed in a region corresponding to the electric element; a shielding sheet disposed on at least a portion of the shield can and closing off at least a portion of the opening; and a heat transfer member disposed between the electric element and the shielding sheet. The shielding sheet has a pre-forming structure, and may have a first portion stacked on at least a portion of the shield can and a second portion formed to protrude in a direction parallel to the first direction to close off at least a portion of the opening.
Inventors:
LEE SENGTAI (KR)
LIM JAEDEOK (KR)
JUNG CHUNGHYO (KR)
LEE SANGGI (KR)
LEE WONJOON (KR)
LIM JAEDEOK (KR)
JUNG CHUNGHYO (KR)
LEE SANGGI (KR)
LEE WONJOON (KR)
Application Number:
PCT/KR2021/000851
Publication Date:
July 29, 2021
Filing Date:
January 21, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H05K7/20
Foreign References:
| US20180103539A1 | 2018-04-12 | |||
| KR20180109615A | 2018-10-08 | |||
| US20060126309A1 | 2006-06-15 | |||
| JPH10145064A | 1998-05-29 | |||
| JP2016006808A | 2016-01-14 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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