Title:
ELECTRONIC DEVICE AND HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/208487
Kind Code:
A1
Abstract:
[Problem] If a plurality of high-heat generating heat sources are provided at a high density, there are cases in which it is not possible to sufficiently dissipate heat by using a common heat dissipation route. [Solution] In the present invention, a different heat dissipation route is used for each heat source. Specifically, a first heat dissipation route is provided such that, from the surface of fins (0324) serving as a first heatsink (0323) provided to the upper surface of a housing, mainly heat of a first heat source (0321) disposed in proximity to such surface is released to the outside of a housing; and a second heat dissipation route is provided such that heat of a second heat source (0322) disposed in proximity to the first heat source is mainly released from holes (0314) provided in the upper surface of the housing due to natural convection inside the housing.
Inventors:
NAKASHIMA TETSUO (JP)
Application Number:
PCT/JP2017/000065
Publication Date:
December 07, 2017
Filing Date:
January 05, 2017
Export Citation:
Assignee:
FXC INC (JP)
International Classes:
H05K7/20; G06F1/20; H01L23/40; H01L23/467
Foreign References:
| JP2008034565A | 2008-02-14 | |||
| JPS60207356A | 1985-10-18 | |||
| JP2007207779A | 2007-08-16 | |||
| JPH04101450A | 1992-04-02 | |||
| JP2010251413A | 2010-11-04 |
Attorney, Agent or Firm:
KUDO, Ichiro (JP)
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