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Patent Searching and Data


Title:
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/045746
Kind Code:
A1
Abstract:
Some embodiments of the present application disclose an electronic device housing and an electronic device. The electronic device housing comprises a casing and a sealing ring, the casing being internally provided with an accommodating cavity for accommodating electronic device components, and a casing wall of the casing being provided with an mounting cavity for mounting the sealing ring; the casing is provided with a first through hole and a second through hole, the first through hole communicating the mounting cavity and the accommodating cavity, and the second through hole communicating the mounting cavity and the outside; the sealing ring comprises a sealing part and a fixed part that is connected to the sealing part, the fixed part being fixed onto the casing wall, and the sealing part blocking the first through hole; the sealing part has elasticity, and when pressure in the accommodating cavity is greater than that of the outside, at least part of the sealing part is separated from the first through hole, so that the accommodating cavity communicates with the mounting cavity, thereby enabling the accommodating cavity to communicate with the outside. The electronic device housing not only has a waterproof function, but also has the function of achieving a balance between internal and external air pressures.

Inventors:
YANG SHUO (CN)
DU ZHIYUAN (CN)
MI BO (CN)
Application Number:
PCT/CN2022/117139
Publication Date:
March 30, 2023
Filing Date:
September 06, 2022
Export Citation:
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Assignee:
GOERTEK INC (CN)
International Classes:
H05K5/06
Foreign References:
CN113784563A2021-12-10
CN106931203A2017-07-07
JP2015108445A2015-06-11
US20170180850A12017-06-22
CN110650608A2020-01-03
CN210093726U2020-02-18
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