Title:
ELECTRONIC DEVICE INCLUDING CERAMIC RESIN COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2023/027563
Kind Code:
A1
Abstract:
Various embodiments of the present disclosure relate to an electronic device including a ceramic resin composite frame. Various embodiments of the present disclosure may provide an electronic device including a ceramic structure, the electronic device comprising: the ceramic structure which forms a part of a housing of the electronic device; and a support member which is disposed within the electronic device and is configured to be connectable to the ceramic structure, wherein a resin bonding layer is disposed between the ceramic structure and the support member.
Inventors:
KIM HAKSOO (KR)
KIM JINHO (KR)
NAM WONSEOK (KR)
HWANG HANGYU (KR)
KIM SOL (KR)
KIM JINHO (KR)
NAM WONSEOK (KR)
HWANG HANGYU (KR)
KIM SOL (KR)
Application Number:
PCT/KR2022/012892
Publication Date:
March 02, 2023
Filing Date:
August 29, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/00; C04B35/106; C08K5/5419; C08L23/26; C08L101/00; C09J11/04; C09J11/06; C09J201/00; H04M1/02
Foreign References:
| KR20210100836A | 2021-08-18 | |||
| KR100795508B1 | 2008-01-16 | |||
| KR101716207B1 | 2017-03-15 | |||
| US20150299528A1 | 2015-10-22 | |||
| KR102178366B1 | 2020-11-13 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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