ELECTRONIC DEVICE INCLUDING COOLING MODULE AND COOLING MODULE CONTROL METHOD THEREOF

Title:

ELECTRONIC DEVICE INCLUDING COOLING MODULE AND COOLING MODULE CONTROL METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2022/086210

Kind Code:

A1

Abstract:

Various embodiments of the present disclosure relate to an electronic device including a cooling module and a cooling module control method thereof. The electronic device may comprise: a housing including an inner space for accommodating an external electronic device therein; a battery disposed in the housing; a detection module disposed in the housing to detect whether the external electronic device is accommodated; at least one cooling module disposed in the housing; at least one processor operatively connected to the detection module and the at least one cooling module; and a memory operatively connected to the at least one processor, wherein the memory stores instructions which when executed, cause the processor to: detect accommodation of the external electronic device in the housing through the detection module; in response to the detection of the accommodation, acquire at least one of operation state information and temperature information of the external electronic device; and control the at least one cooling module on the basis of at least one of the operation state information and the temperature information. Various other embodiments are also possible.

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Inventors:

PARK JEONGWON (KR)
KIM CHULKWI (KR)
YOO YOUNSANG (KR)
YOON JONGMIN (KR)
PARK CHANMIN (KR)
YEOM DONGHYUN (KR)

Application Number:

PCT/KR2021/014800

Publication Date:

April 28, 2022

Filing Date:

October 21, 2021

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K7/20; A45C11/00; G06F1/20

Foreign References:

KR20140065090A	2014-05-29
US20160042202A1	2016-02-11
KR20180109550A	2018-10-08
JP2014110580A	2014-06-12
KR20200079154A	2020-07-02

Attorney, Agent or Firm:

KWON, Hyuk-Rok et al. (KR)

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