Title:
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2021/221364
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure comprises: a first electrical element; a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet, and which includes a first area that faces the first electrical element, a second area spaced from the first area, and a third area arranged between the first area and the second area. In the first area, a part of the heat diffusion member is arranged in the first direction toward the first electrical element and a part of the anti-shock member is arranged in the second direction that is opposite to the first direction, and in the second area, the other part of the heat diffusion member is arranged in the second direction and the other part of the anti-shock member is arranged in the first direction, and another part of the heat diffusion member arranged in the third area extends from the heat diffusion member in the first area so as to be connectable to the heat diffusion member in the second area.
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Inventors:
CHUNG HAEIN (KR)
KOO KYUNGHA (KR)
KIM KANGSIK (KR)
KIM WONMIN (KR)
KOO KYUNGHA (KR)
KIM KANGSIK (KR)
KIM WONMIN (KR)
Application Number:
PCT/KR2021/004854
Publication Date:
November 04, 2021
Filing Date:
April 19, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; H04M1/02
Foreign References:
| JP2002352575A | 2002-12-06 | |||
| KR20160096927A | 2016-08-17 | |||
| JP2006235564A | 2006-09-07 | |||
| JP2009111171A | 2009-05-21 | |||
| JP2000031674A | 2000-01-28 |
Other References:
See also references of EP 4132245A4
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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