ELECTRONIC DEVICE INCLUDING SOUND ASSEMBLY

WIPO Patent Application WO/2022/098089

A1

An electronic device according to various embodiments of the present disclosure may include: a first housing; a second housing which accommodates at least a part of the first housing and is formed to guide a slide movement of the first housing; and a sound assembly including a sound component which includes a sound circuit disposed in the first housing, a first conduit line which extends from the sound component toward a first end part of the first housing, and a second conduit line which extends from the edge portion of the second housing to a second end part of the second housing, which is directed toward the first housing. When the first housing is accommodated in the second housing, the first end part of the first housing or the second end part of the second housing, which allows the first conduit line and the second conduit line to be connected to each other, may be provided to have a shape having a designated inclination with respect to the edge portion of the second housing.

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PARK CHOONGHYO (KR)
KIM KIWON (KR)
SIM MYOUNGSUNG (KR)
YOON CHANGSHIK (KR)
CHO WOOJIN (KR)
CHO JOONRAE (KR)
KANG HYUNGGWANG (KR)
LEE BYOUNGHEE (KR)
HWANG HOCHUL (KR)

PCT/KR2021/015805

May 12, 2022

November 03, 2021

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SAMSUNG ELECTRONICS CO LTD (KR)

G06F1/16

KR20070011810A	2007-01-25
JP2009038430A	2009-02-19
KR20130076450A	2013-07-08
KR20100032206A	2010-03-25
US20190305237A1	2019-10-03

LEE, Keon-Joo et al. (KR)

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