Title:
ELECTRONIC DEVICE INCLUDING STRUCTURE FOR REMOVING ELECTRICAL STRESS, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/131818
Kind Code:
A1
Abstract:
An electronic device is provided. The electronic device comprises: a printed circuit board having a plurality of printed circuit boards stacked thereon, and including a hole penetrating the plurality of printed circuit boards; a microphone which is arranged on a first surface of the printed circuit board and which allows sound to be transmitted through the hole; and an electric conduction path formed in at least a part or all through the hole, wherein the electric conduction path can be electrically connected to the ground of the printed circuit board and/or the ground of the microphone.
Inventors:
LEE HONGKYU (KR)
NA HYOSEOK (KR)
NA HYOSEOK (KR)
Application Number:
PCT/KR2021/019176
Publication Date:
June 23, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H04M1/02; H04R19/04; H05F3/02
Domestic Patent References:
| WO2020208481A1 | 2020-10-15 |
Foreign References:
| US20080144874A1 | 2008-06-19 | |||
| KR20200109903A | 2020-09-23 | |||
| US20180376039A1 | 2018-12-27 | |||
| US20180098143A1 | 2018-04-05 |
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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