ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

Title:

ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2010/052871

Kind Code:

A1

Abstract:

Provided is an electronic device manufacturing method wherein a first terminal of a first electronic component and a second terminal of a second electronic component are bonded by using a solder and the first electronic component and the second electronic component are electrically connected. The method has a step wherein a resin layer having flux effects is arranged between the first terminal and the second terminal and a laminated body which includes the first electronic component, the second electronic component and the resin layer is obtained, a solder bonding step wherein the first terminal and the second terminal are bonded with the solder, and a pressurizing curing step wherein the resin layer is cured while pressurizing the laminated body by means of a pressurizing fluid.

Inventors:

MEURA TORU (JP)
NIKAIDO HIROKI (JP)
MAEJIMA KENZOU (JP)
ISHIMURA YOJI (JP)

Application Number:

PCT/JP2009/005770

Publication Date:

May 14, 2010

Filing Date:

October 30, 2009

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
MEURA TORU (JP)
NIKAIDO HIROKI (JP)
MAEJIMA KENZOU (JP)
ISHIMURA YOJI (JP)

International Classes:

H05K3/34; B23K1/00; B23K3/00; B23K35/363; H01L21/60; H05K3/28

Foreign References:

JP2004311709A	2004-11-04
JP2002241617A	2002-08-28
JP2001313312A	2001-11-09
JP2005307169A	2005-11-04
JPH03184695A	1991-08-12
JP2001311005A	2001-11-09

Other References: